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We manufacture a variety of flat through-hole printed circuit boards.
By filling in only the BGA/CSP section, we are able to flatten the surface mount pads (compatible with 0.35mm pitch) and permanently fill all mini Via holes, among other variations, allowing us to manufacture a wide range of flat through-hole PCBs according to product specifications.
It is now possible to create high-difficulty fine patterns like never before!
Our company has introduced the "LI-9200 Mercurex" manufactured by SCREEN PE Solutions. This has made it possible to create fine patterns with higher difficulty than ever before. 【Direct Imaging System】 ■ Manufactured by SCREEN PE Solutions ■ "LI-9200 Mercurex" *For more details, please refer to the PDF document or feel free to contact us.
Information on various materials that can be handled and manufacturing conditions that can be accommodated by our company.
This is an introduction to various materials and manufacturing conditions that we can handle. For specifications not listed, please feel free to consult with us. 【Printed Circuit Board Specifications】 ＜Minimum L/S＞ ■ Outer layer 18μm: 100/100μm ■ Outer layer 35μm: 150/150μm ■ Outer layer 70μm: 250/250μm ■ Outer layer 12μm: 80/80μm (pad-on-via mixing not allowed) ■ Inner layer 35μm: 80/80μm ■ Inner layer 70μm: 200/200μm *For more details, please refer to the PDF document or feel free to contact us.
Minimum L/S, manufacturable layer count, board thickness, etc.! Introducing our printed circuit board specifications.
We would like to introduce the "Printed Circuit Board Specifications" handled by Screen Process Co., Ltd. The maximum IVH interlayer thickness can accommodate up to 0.4t and the minimum hole diameter is φ0.1mm. We also support sequential IVH. For more details, please refer to the catalog. 【Minimum L/S】 ■ Outer layer 18μm: 100/100μm ■ Outer layer 35μm: 150/150μm ■ Outer layer 70μm: 250/250μm ■ Outer layer 12μm: 80/80μm (pads and vias cannot be mixed) ■ Inner layer 35μm: 80/80μm ■ Inner layer 70μm: 200/200μm *For more details, please refer to the PDF document or feel free to contact us.
Introducing our substrate specifications, including MCL-E-67 and R-1766!
We would like to introduce the specifications of the substrates handled by Screen Process Co., Ltd. The "NP-140TL" from Nanya has a UL/ANSI grade of FR-4.0, with its main application being general-purpose, and a thermal conductivity of 0.4W/mK. For more details, please refer to the catalog. 【MCL-E-67 Specifications (Partial)】 ■ Substrate Manufacturer: Hitachi Chemical ■ UL/ANSI Grade: FR-4.0 ■ Main Application: General-purpose ■ Glass Transition Temperature ・TMA Method: 120–130 ・DMA Method: 150–160 *For more details, please refer to the PDF document or feel free to contact us.
